Wednesday, September 24, 2003
Now, THIS is good! BTW, did you catch the flexible displays in the premier of the TV movie "Red Planet"?
New electronic paper displays video too. Wednesday, September 24, 2003 Posted: 2:49 PM EDT (1849 GMT). LONDON, England (Reuters) -- Even before the electronic ink has dried on the e-page, a new generation of electronic paper may soon be able to bring a moving image to a foldable screen near you, according to scientists in the Netherlands.
Hot on the heels of the invention of a wafer-thin foldable screen that can display static type and may one day replace newspapers as it can be overwritten each day, scientists at Philips Research in Eindhoven have found a way to display high-definition moving pictures as well.
Using a process called electrowetting, the scientists claim to be able to manipulate colored oils in the pixels on the page with such speed and accuracy as to be able to generate clear and accurate video displays.
"The reflectivity and contrast of our system approach those of paper," they wrote in the science journal Nature. "In addition, we demonstrate a color concept which is intrinsically four times brighter than reflective liquid-crystal displays and twice as bright as other emerging technologies."
Not only does e-paper work on very low voltages, but its light weight and great flexibility give it a multitude of potential applications from computer screens to wearable cinematic suits.
With an e-paper screen sewn into a jacket, wearers could read e-mail or even watch the news on their sleeves while hot-footing it from one meeting to another.
(Source: CNN/Technology)
New electronic paper displays video too. Wednesday, September 24, 2003 Posted: 2:49 PM EDT (1849 GMT). LONDON, England (Reuters) -- Even before the electronic ink has dried on the e-page, a new generation of electronic paper may soon be able to bring a moving image to a foldable screen near you, according to scientists in the Netherlands.
Hot on the heels of the invention of a wafer-thin foldable screen that can display static type and may one day replace newspapers as it can be overwritten each day, scientists at Philips Research in Eindhoven have found a way to display high-definition moving pictures as well.
Using a process called electrowetting, the scientists claim to be able to manipulate colored oils in the pixels on the page with such speed and accuracy as to be able to generate clear and accurate video displays.
"The reflectivity and contrast of our system approach those of paper," they wrote in the science journal Nature. "In addition, we demonstrate a color concept which is intrinsically four times brighter than reflective liquid-crystal displays and twice as bright as other emerging technologies."
Not only does e-paper work on very low voltages, but its light weight and great flexibility give it a multitude of potential applications from computer screens to wearable cinematic suits.
With an e-paper screen sewn into a jacket, wearers could read e-mail or even watch the news on their sleeves while hot-footing it from one meeting to another.
(Source: CNN/Technology)
And, also from sunny California...
This week, California also became the first state to protect the privacy of drivers whose vehicles come with "black boxes," devices that store data on how a car is being driven in the seconds before a collision.
The law, signed by Davis on Monday, stipulates that car owners must be told their cars carry the recorders, and says the information can only be downloaded with consent from the driver, a court order or for medical or safety research.
The devices can record speed, the use of brakes and seatbelts, and the deployment of air bags. Unlike airplane black boxes, the devices don't gather voice recordings.
(Source: CNN/Technology)
This week, California also became the first state to protect the privacy of drivers whose vehicles come with "black boxes," devices that store data on how a car is being driven in the seconds before a collision.
The law, signed by Davis on Monday, stipulates that car owners must be told their cars carry the recorders, and says the information can only be downloaded with consent from the driver, a court order or for medical or safety research.
The devices can record speed, the use of brakes and seatbelts, and the deployment of air bags. Unlike airplane black boxes, the devices don't gather voice recordings.
(Source: CNN/Technology)
About time!...Hey, maybe they should not recall this guy...or, maybe we can offer him a Governorship here in NY...or...
SACRAMENTO, California (AP) -- California will prohibit Internet advertisers from sending unsolicited e-mails under the toughest law of its kind in the nation, providing for fines up to $1 million. Gov. Gray Davis signed legislation Tuesday that targets not only the firms that package and send spam to consumers, but also the companies whose products and services are being advertised.
The measure covers all unsolicited commercial e-mail sent or received in California and imposes fines of up to $1 million per incident.
"There are no loopholes, no way of getting around it," said the bill's author, state Sen. Kevin Murray, a Democrat.
Washington state passed an anti-spam measure in 1998, but it didn't go as far. The Washington law provides civil penalties of $500 per message for bulk or commercial e-mail with misleading information in the subject line, invalid reply addresses or disguised paths of transmission.
A San Francisco-based marketing firm, Ferris Research, estimated that unwanted e-mails cost U.S. companies nearly $9 billion in 2002 in lost productivity, consumption of communication bandwidth and drain of technical support.
"California is sending a clear message to Internet spammers: we will not allow you to litter the information superhighway with e-mail trash," said Davis in a statement.
(Source: CNN/Technology)
SACRAMENTO, California (AP) -- California will prohibit Internet advertisers from sending unsolicited e-mails under the toughest law of its kind in the nation, providing for fines up to $1 million. Gov. Gray Davis signed legislation Tuesday that targets not only the firms that package and send spam to consumers, but also the companies whose products and services are being advertised.
The measure covers all unsolicited commercial e-mail sent or received in California and imposes fines of up to $1 million per incident.
"There are no loopholes, no way of getting around it," said the bill's author, state Sen. Kevin Murray, a Democrat.
Washington state passed an anti-spam measure in 1998, but it didn't go as far. The Washington law provides civil penalties of $500 per message for bulk or commercial e-mail with misleading information in the subject line, invalid reply addresses or disguised paths of transmission.
A San Francisco-based marketing firm, Ferris Research, estimated that unwanted e-mails cost U.S. companies nearly $9 billion in 2002 in lost productivity, consumption of communication bandwidth and drain of technical support.
"California is sending a clear message to Internet spammers: we will not allow you to litter the information superhighway with e-mail trash," said Davis in a statement.
(Source: CNN/Technology)
WOW!
Tests of AMD's 64-bit PCs: Fastest yet. Wednesday, September 24, 2003 Posted: 11:43 AM EDT (1543 GMT). SAN JOSE, California (AP) -- After years of following Intel Corp.'s lead, Advanced Micro Devices Inc. changed course Tuesday and launched a line of personal computer processors with features typically found only in high-end computers and servers.
Click here for whole story.
Tests of AMD's 64-bit PCs: Fastest yet. Wednesday, September 24, 2003 Posted: 11:43 AM EDT (1543 GMT). SAN JOSE, California (AP) -- After years of following Intel Corp.'s lead, Advanced Micro Devices Inc. changed course Tuesday and launched a line of personal computer processors with features typically found only in high-end computers and servers.
Click here for whole story.
It's nice to see the "ducks firing at the guns..."
Makers of Kazaa suing record labels. Wednesday, September 24, 2003 Posted: 10:30 AM EDT (1430 GMT). LOS ANGELES, California (AP) -- Turning the tables on record labels, makers of the most popular Internet song-swapping network are suing entertainment companies for copyright infringement.
Sharman Networks Ltd., the company behind the Kazaa file-sharing software, filed a federal lawsuit Monday accusing the entertainment companies of using unauthorized versions of its software in their efforts to root out users. Entertainment companies have offered bogus versions of copyright works and sent online messages to users.
Sharman said the companies used Kazaa Lite, an ad-less replica of its software, to get onto the network. The lawsuit also claims efforts to combat piracy on Kazaa violated terms for using the network.
Sharman's lawsuit also revives its previous allegation that the entertainment companies violated antitrust laws by stopping Sharman and its partner from distributing authorized copies of music and movies through Kazaa.
U.S. District Judge Stephen V. Wilson rejected those claims in July but last week allowed Sharman to try again. Sharman is incorporated in the South Pacific island nation of Vanuatu with main offices in Sydney, Australia.
The Recording Industry Association of America called Sharman's "newfound admiration for the importance of copyright law" ironic and "self-serving."
Universal Music Group and Warner Music Group, a division of CNN's parent company AOL Time Warner, declined to comment on Sharman's latest lawsuit.
Recording companies sued 261 music fans this month, claiming they were illegally distributing hundreds of digital song files apiece over the Internet. The industry trolled file-sharing networks such as Kazaa and downloaded song files from users' computers.
Once the industry determined a downloaded song file was a copyright work, they issued subpoenas to Internet access providers to find out who was behind the account used to log onto the file-sharing network.
(Source: CNN/Technology)
Makers of Kazaa suing record labels. Wednesday, September 24, 2003 Posted: 10:30 AM EDT (1430 GMT). LOS ANGELES, California (AP) -- Turning the tables on record labels, makers of the most popular Internet song-swapping network are suing entertainment companies for copyright infringement.
Sharman Networks Ltd., the company behind the Kazaa file-sharing software, filed a federal lawsuit Monday accusing the entertainment companies of using unauthorized versions of its software in their efforts to root out users. Entertainment companies have offered bogus versions of copyright works and sent online messages to users.
Sharman said the companies used Kazaa Lite, an ad-less replica of its software, to get onto the network. The lawsuit also claims efforts to combat piracy on Kazaa violated terms for using the network.
Sharman's lawsuit also revives its previous allegation that the entertainment companies violated antitrust laws by stopping Sharman and its partner from distributing authorized copies of music and movies through Kazaa.
U.S. District Judge Stephen V. Wilson rejected those claims in July but last week allowed Sharman to try again. Sharman is incorporated in the South Pacific island nation of Vanuatu with main offices in Sydney, Australia.
The Recording Industry Association of America called Sharman's "newfound admiration for the importance of copyright law" ironic and "self-serving."
Universal Music Group and Warner Music Group, a division of CNN's parent company AOL Time Warner, declined to comment on Sharman's latest lawsuit.
Recording companies sued 261 music fans this month, claiming they were illegally distributing hundreds of digital song files apiece over the Internet. The industry trolled file-sharing networks such as Kazaa and downloaded song files from users' computers.
Once the industry determined a downloaded song file was a copyright work, they issued subpoenas to Internet access providers to find out who was behind the account used to log onto the file-sharing network.
(Source: CNN/Technology)
Tuesday, September 23, 2003
Hey Have You Thought of This...
My 15 year old kid asked me the other day: If ignorance is bliss, why aren't more people happy? He's got a point.
Or, Have you ever noticed anyone going slower than you is an idiot and anyone going faster than you is a maniac?
Or that people are more violently opposed to fur than leather because it's safer to harass rich women than motorcycle gangs?
Think about it.
My 15 year old kid asked me the other day: If ignorance is bliss, why aren't more people happy? He's got a point.
Or, Have you ever noticed anyone going slower than you is an idiot and anyone going faster than you is a maniac?
Or that people are more violently opposed to fur than leather because it's safer to harass rich women than motorcycle gangs?
Think about it.
No more "price check on aisle four."
STMicro inks RFID pact. September 18, 2003 - STMicroelectronics, Geneva, Switzerland, and Alien Technology Corp., Morgan Hill, CA, have agreed to jointly design, develop, and manufacture low-cost RFID technology, with STMicro serving as a second-source for Alien's EPD Class 1 chips.
The companies, both members of industry consortium Auto-ID, aim to produce by 1Q04 an RFID chip costing less than a penny, compared with current RFID chips which can cost as much as $0.50.
(Source: SST's Semiconductor Weekely)
STMicro inks RFID pact. September 18, 2003 - STMicroelectronics, Geneva, Switzerland, and Alien Technology Corp., Morgan Hill, CA, have agreed to jointly design, develop, and manufacture low-cost RFID technology, with STMicro serving as a second-source for Alien's EPD Class 1 chips.
The companies, both members of industry consortium Auto-ID, aim to produce by 1Q04 an RFID chip costing less than a penny, compared with current RFID chips which can cost as much as $0.50.
(Source: SST's Semiconductor Weekely)
And for the Geeks among us...
IBM demonstrates the first SSDOI transistors. 9 September 2003. IBM has successfully demonstrated two new technologies for fabricating Si-based transistors that could enter mass production before too long.
IBM has developed the first transistor to use strained silicon directly on insulator (SSDOI) substrate technology, and has also demonstrated Si substrates with a hybrid of crystal orientations.
The improvements in carrier mobility that can be achieved using strained Si as the channel material in MOS transistors are expected to provide an answer to the problem of continuing the upward performance trend of CMOS as the Si industry approaches the fundamental limits of scaling transistor dimensions.
IBM and others have reported a 20-30 % performance enhancement in NMOS devices using strained silicon channels grown onto relaxed SiGe buffers. However, the presence of a SiGe layer causes material and process integration challenges. Several research groups including IBM, MIT and AmberWave Systems have demonstrated processes for producing SSDOI substrates, but IBM claims to be the first to fabricate transistors using SSDOI material.
The SSDOI structure was created by transferring strained Si, grown epitaxially onto a relaxed SiGe buffer, to a buried oxide layer. The SiGe layer was removed, thus creating the SSDOI material (see SSDOI process demonstration). Strain retention was confirmed in the strained Si layer after the layer transfer process and thermal cycles. Electron and hole mobility enhancements were confirmed in MOSFETs fabricated on SSDOI and fabrication of sub-60 nm FETs were also demonstrated on SSDOI.
Another way to improve CMOS performance is to increase the hole mobility in the device channels. For a given level of strain, the mobility enhancement for holes is less than that for electrons. IBM has been able to integrate devices with 2.5 times higher hole mobility into conventional CMOS technology by combining two substrates in the same wafer. This has resulted in a 40-65% performance enhancement over conventional PMOS devices.
For PFETs, hole mobility is known to be 2.5 times higher on (110) Si compared to that on standard wafer with (100) surface-orientation. IBM has created a hybrid-orientation technology (HOT) where CMOS devices are fabricated on hybrid substrate with different crystal orientations to achieve significant PFET performance enhancement. In the HOT technology, layer transfer processes, block-level trench etch, and epitaxial regrowth were performed before conventional CMOS device processing. An enhancement of 40-65% for the PFET was demonstrated on a 90 nm node CMOS technology
(Source: Compound Semiconductor)
IBM demonstrates the first SSDOI transistors. 9 September 2003. IBM has successfully demonstrated two new technologies for fabricating Si-based transistors that could enter mass production before too long.
IBM has developed the first transistor to use strained silicon directly on insulator (SSDOI) substrate technology, and has also demonstrated Si substrates with a hybrid of crystal orientations.
The improvements in carrier mobility that can be achieved using strained Si as the channel material in MOS transistors are expected to provide an answer to the problem of continuing the upward performance trend of CMOS as the Si industry approaches the fundamental limits of scaling transistor dimensions.
IBM and others have reported a 20-30 % performance enhancement in NMOS devices using strained silicon channels grown onto relaxed SiGe buffers. However, the presence of a SiGe layer causes material and process integration challenges. Several research groups including IBM, MIT and AmberWave Systems have demonstrated processes for producing SSDOI substrates, but IBM claims to be the first to fabricate transistors using SSDOI material.
The SSDOI structure was created by transferring strained Si, grown epitaxially onto a relaxed SiGe buffer, to a buried oxide layer. The SiGe layer was removed, thus creating the SSDOI material (see SSDOI process demonstration). Strain retention was confirmed in the strained Si layer after the layer transfer process and thermal cycles. Electron and hole mobility enhancements were confirmed in MOSFETs fabricated on SSDOI and fabrication of sub-60 nm FETs were also demonstrated on SSDOI.
Another way to improve CMOS performance is to increase the hole mobility in the device channels. For a given level of strain, the mobility enhancement for holes is less than that for electrons. IBM has been able to integrate devices with 2.5 times higher hole mobility into conventional CMOS technology by combining two substrates in the same wafer. This has resulted in a 40-65% performance enhancement over conventional PMOS devices.
For PFETs, hole mobility is known to be 2.5 times higher on (110) Si compared to that on standard wafer with (100) surface-orientation. IBM has created a hybrid-orientation technology (HOT) where CMOS devices are fabricated on hybrid substrate with different crystal orientations to achieve significant PFET performance enhancement. In the HOT technology, layer transfer processes, block-level trench etch, and epitaxial regrowth were performed before conventional CMOS device processing. An enhancement of 40-65% for the PFET was demonstrated on a 90 nm node CMOS technology
(Source: Compound Semiconductor)
More Local Interest Stuff...
IBM and Agilent start optical interconnect program. 11 September 2003. Two major electronics and optoelectronics businesses are combining their talents to take optical communication technology down to the chip level.
IBM and Agilent Technologies are teaming up to develop optical interconnects as part of a multi-year, $30 million project funded by the Defense Advanced Research Projects Agency (DARPA). This program aims bring the benefits of optical interconnects, which currently carry data between computer systems, into the servers themselves.
The total communications bandwidth inside servers has been increasing by roughly 10 times every four years, driven by increasing chip speeds and the number of processors per system. By 2010, a bandwidth of about 40 Tbit/s between microprocessors will be required. Agilent and IBM plan to develop optical-interconnect technology that delivers this bandwidth in time to meet this need while simultaneously addressing power, cost, density, and reliability issues.
(Source: Compound Semiconductor)
IBM and Agilent start optical interconnect program. 11 September 2003. Two major electronics and optoelectronics businesses are combining their talents to take optical communication technology down to the chip level.
IBM and Agilent Technologies are teaming up to develop optical interconnects as part of a multi-year, $30 million project funded by the Defense Advanced Research Projects Agency (DARPA). This program aims bring the benefits of optical interconnects, which currently carry data between computer systems, into the servers themselves.
The total communications bandwidth inside servers has been increasing by roughly 10 times every four years, driven by increasing chip speeds and the number of processors per system. By 2010, a bandwidth of about 40 Tbit/s between microprocessors will be required. Agilent and IBM plan to develop optical-interconnect technology that delivers this bandwidth in time to meet this need while simultaneously addressing power, cost, density, and reliability issues.
(Source: Compound Semiconductor)
And...more good news...
Sunny mid-quarter reports brighten industry outlook. Still watching the clock (or calendar) in anticipation of the industry's rumored-to-be-approaching recovery? Financials for 2Q03 were mixed, with most companies still clinging to the popular catchphrase "cautious optimism." Halfway through the third quarter, however, many big-name chipmaking firms are upping their estimates, and for the most part, Wall Street is cheering (although it was disappointed with TI's news).
(Source: SST's Semiconductor Weekely)
Sunny mid-quarter reports brighten industry outlook. Still watching the clock (or calendar) in anticipation of the industry's rumored-to-be-approaching recovery? Financials for 2Q03 were mixed, with most companies still clinging to the popular catchphrase "cautious optimism." Halfway through the third quarter, however, many big-name chipmaking firms are upping their estimates, and for the most part, Wall Street is cheering (although it was disappointed with TI's news).
(Source: SST's Semiconductor Weekely)
Big Blue lands more work...Good! Maybe they'll find a reason to save BTV? Or, is this a job for the spify 300 mm fab in EF? Stay tunned...
IBM, Intersil ink foundry deal. September 11, 2003 - IBM's microelectronics division will serve as a second-source manufacturer for power management ICs from Intersil Corp., Milpitas, CA, the two companies have announced. Under the multi-year deal, IBM will install Intersil P6 process technology in its Burlington, VT, facility, and may incorporate other Intersil or jointly-developed processes. The first ICs from this agreement will be manufactured in 1Q04.
(Source: SST's Semiconductor Weekely)
IBM, Intersil ink foundry deal. September 11, 2003 - IBM's microelectronics division will serve as a second-source manufacturer for power management ICs from Intersil Corp., Milpitas, CA, the two companies have announced. Under the multi-year deal, IBM will install Intersil P6 process technology in its Burlington, VT, facility, and may incorporate other Intersil or jointly-developed processes. The first ICs from this agreement will be manufactured in 1Q04.
(Source: SST's Semiconductor Weekely)
They are heeere...Hot gadgets for fall
Wish-list for Santa: DVDs, digital cameras, flat-screen TVs and a cell phone with an MP3 player.NEW YORK - Chocolates, CDs, ties and cute mugs are old hat. To score big points over the holidays, go for the credit-card-size digital camera, or a wireless phone with a built-in MP3 player.
Go here for the whole story...and to drool a bit.
(Source: CNN/Money)
Wish-list for Santa: DVDs, digital cameras, flat-screen TVs and a cell phone with an MP3 player.NEW YORK - Chocolates, CDs, ties and cute mugs are old hat. To score big points over the holidays, go for the credit-card-size digital camera, or a wireless phone with a built-in MP3 player.
Go here for the whole story...and to drool a bit.
(Source: CNN/Money)
Cool!
White LEDs offer new automotive design options. 18 September 2003. Valeo, a major automotive supplier, has announced that it is developing bright white LED-based lights for a wide range of front lighting applications.
The company announced at the recent Frankfurt motor show that its LED-based front lighting products could be in series production in three years.
The company’s chairman and CEO, Thierry Morin, said that Valeo has proven design and development expertise for LED technology for rear lighting applications such as rear combination lamps and center-high-mounted stop lights.
"Valeo is now extending this technology to front lighting functions,” said Morin. “These have the potential to achieve significant performance benefits, especially for adaptive lighting functions, as well as highly desired styling flexibility which will differentiate new top-end models by creating distinctive signatures.”
Recent increases in LED performance, combined with their small size, low power consumption and high reliability, make LED technology a realistic option for automotive designers specializing in exterior lighting. White LEDs used in front lighting applications are expected to become a prominent design feature of future top-end vehicles.
Valeo is developing LED technology in collaboration with Valeo Sylvania of North America and Ichikoh Industries of Japan.
At the front of the car, Valeo is developing position lamps, turn signals, front fog lamps, daytime running lights, and low beam headlights using LED technology. A unique characteristic of using LEDs as a light source is the availability of a full range of optical solutions that cover this wide variety of functions.
Optical lenses are proposed for functions such as direction indicators and daylight running lights, while a reflector or optical fiber light-guide is suitable for the position lamp. Other front lighting functions such as fog lamps, low beam headlights will be implemented using special optical modules to create cut-off lines required by lighting regulations.
In addition to optics, integrated control electronics and thermal management are essential features of LED front lighting.
Compared to traditional incandescent lamps with equivalent output, LEDs consume significantly less power and since the lifespan of LEDs is longer than that of the vehicle itself, carmakers may choose to omit additional design space to change an LED.
Car owners can be confident that the lights will switch on whenever required. The compact size of LEDs contributes to greater design freedom, allowing for the integration of lighting functions into the overall front-end design.
By working on a complete LED system, Valeo says that it can assure carmakers that the front lighting system is compatible with the technical requirements of carmakers' diverse vehicle architectures.
(SOURCE: Compound Semocinductor News)
White LEDs offer new automotive design options. 18 September 2003. Valeo, a major automotive supplier, has announced that it is developing bright white LED-based lights for a wide range of front lighting applications.
The company announced at the recent Frankfurt motor show that its LED-based front lighting products could be in series production in three years.
The company’s chairman and CEO, Thierry Morin, said that Valeo has proven design and development expertise for LED technology for rear lighting applications such as rear combination lamps and center-high-mounted stop lights.
"Valeo is now extending this technology to front lighting functions,” said Morin. “These have the potential to achieve significant performance benefits, especially for adaptive lighting functions, as well as highly desired styling flexibility which will differentiate new top-end models by creating distinctive signatures.”
Recent increases in LED performance, combined with their small size, low power consumption and high reliability, make LED technology a realistic option for automotive designers specializing in exterior lighting. White LEDs used in front lighting applications are expected to become a prominent design feature of future top-end vehicles.
Valeo is developing LED technology in collaboration with Valeo Sylvania of North America and Ichikoh Industries of Japan.
At the front of the car, Valeo is developing position lamps, turn signals, front fog lamps, daytime running lights, and low beam headlights using LED technology. A unique characteristic of using LEDs as a light source is the availability of a full range of optical solutions that cover this wide variety of functions.
Optical lenses are proposed for functions such as direction indicators and daylight running lights, while a reflector or optical fiber light-guide is suitable for the position lamp. Other front lighting functions such as fog lamps, low beam headlights will be implemented using special optical modules to create cut-off lines required by lighting regulations.
In addition to optics, integrated control electronics and thermal management are essential features of LED front lighting.
Compared to traditional incandescent lamps with equivalent output, LEDs consume significantly less power and since the lifespan of LEDs is longer than that of the vehicle itself, carmakers may choose to omit additional design space to change an LED.
Car owners can be confident that the lights will switch on whenever required. The compact size of LEDs contributes to greater design freedom, allowing for the integration of lighting functions into the overall front-end design.
By working on a complete LED system, Valeo says that it can assure carmakers that the front lighting system is compatible with the technical requirements of carmakers' diverse vehicle architectures.
(SOURCE: Compound Semocinductor News)
Hey! This is sounding more and more like a "Tricorder"
NONINVASIVE CANCER DETECTION. An MIT interdepartmental laboratory has developed two new methods that may one day replace tissue biopsies in diagnosing certain types of cancers. The devices use spectroscopic detection and imaging to noninvasively identify precancerous cells in just a fraction of a second.
The device detects precancerous tissue by sequentially delivering laser light of 10 different colors to the tissue via an optical fiber probe. The probe
consists of a bundle of optical fibers with a diameter of just over 1mm, making it compatible with standard endoscopes. The same probe collects the returning light, which is then analyzed using a spectrograph and computer software.
The portable instrument has already shown promising results in clinical studies by identifying precancerous changes in the colon, bladder, esophagus, cervix, and oral cavity.
A second device, which has not yet been tested on patients, can image precancerous features over tissue areas up to a few centimeters in diameter.
Visit here for the complete story.
NONINVASIVE CANCER DETECTION. An MIT interdepartmental laboratory has developed two new methods that may one day replace tissue biopsies in diagnosing certain types of cancers. The devices use spectroscopic detection and imaging to noninvasively identify precancerous cells in just a fraction of a second.
The device detects precancerous tissue by sequentially delivering laser light of 10 different colors to the tissue via an optical fiber probe. The probe
consists of a bundle of optical fibers with a diameter of just over 1mm, making it compatible with standard endoscopes. The same probe collects the returning light, which is then analyzed using a spectrograph and computer software.
The portable instrument has already shown promising results in clinical studies by identifying precancerous changes in the colon, bladder, esophagus, cervix, and oral cavity.
A second device, which has not yet been tested on patients, can image precancerous features over tissue areas up to a few centimeters in diameter.
Visit here for the complete story.
Thursday, September 04, 2003
Hey, put on your thinking caps! Can you make...
A dye, additive, or multicomponent material is needed that is
preferably colorless or has a light color and changes into a dark
color when a very brief temperature pulse reaching a temperature of
hundreds of degrees Celsius is applied.
The substance should be miscible with anionic latex in an aqueous
solution or dispersion without disturbing the stability of the latex.
When present in latex, it should be stable for at least a year in
its initial state. It also should be stable under daylight conditions
and should withstand temperatures up to 60 degrees C. The substance
should be environmentally acceptable so no hazard occurs during waste
removal.
To respond to this Tech Need visit:
http://link.abpi.net/l.php?20030904A3
Serious, this is a realy need and you could make some serious $$$ in the meantime.
(Sourcez: NASA Tech Briefs)
A dye, additive, or multicomponent material is needed that is
preferably colorless or has a light color and changes into a dark
color when a very brief temperature pulse reaching a temperature of
hundreds of degrees Celsius is applied.
The substance should be miscible with anionic latex in an aqueous
solution or dispersion without disturbing the stability of the latex.
When present in latex, it should be stable for at least a year in
its initial state. It also should be stable under daylight conditions
and should withstand temperatures up to 60 degrees C. The substance
should be environmentally acceptable so no hazard occurs during waste
removal.
To respond to this Tech Need visit:
http://link.abpi.net/l.php?20030904A3
Serious, this is a realy need and you could make some serious $$$ in the meantime.
(Sourcez: NASA Tech Briefs)
Wednesday, September 03, 2003
Chill Out! A Slurpee could save your life...
Argonne National Laboratory researchers, in collaboration with the University of
Chicago, are working to improve the odds of surviving cardiac arrest and stroke.
They have shown that ice-particle slurries can be engineered to provide rapid
internal cooling of the heart and brain, inducing localized hypothermia that
slows and reduces cell death.
The technique involves injecting a specially formulated ice-particle slurry into
in-body heat exchangers (i.e., under the skin on both sides of the patient's
neck) and also filling the lungs. In simulations, this lowers the core
temperature of the brain and heart to a safe 77 degrees F in just ten minutes.
To get the same degree of cooling by conventional methods requires on the order
of two hours -- far too long in a medical emergency.
(Source: NASA TEch Briefs)
Argonne National Laboratory researchers, in collaboration with the University of
Chicago, are working to improve the odds of surviving cardiac arrest and stroke.
They have shown that ice-particle slurries can be engineered to provide rapid
internal cooling of the heart and brain, inducing localized hypothermia that
slows and reduces cell death.
The technique involves injecting a specially formulated ice-particle slurry into
in-body heat exchangers (i.e., under the skin on both sides of the patient's
neck) and also filling the lungs. In simulations, this lowers the core
temperature of the brain and heart to a safe 77 degrees F in just ten minutes.
To get the same degree of cooling by conventional methods requires on the order
of two hours -- far too long in a medical emergency.
(Source: NASA TEch Briefs)
Changeling Plane? Cool!
On July 28, a NASA research jet flew to Oshkosh, WI to join the world's
largest aviation event: The Experimental Aircraft Association's
AirVenture 2003. Celebrating a century of flight, the festivities included
a NASA F/A-18 with the ability to twist its wings causing the
airplane to roll. Called wing-warping, the technique was once exploited
by the Wright brothers.
Conducted by NASA's Dryden Flight Research Center, the Active Aeroelastic
Wing program utilizes special pliable wings to initiate roll. Soon, new flight
control software will prompt the ailerons (aircraft roll control) and movable
leading edge control surfaces to respond to normal pilot stick inputs by causing
the wings to deflect. The roll induced in this manner will make the aircraft
independent of horizontal stabilizer inputs to keep it on course in a roll.
The ability to use computer flight control programs and flexible wings could
lead to future high-performance aircraft with lighter, less mechanically
complex wings. Wing-warping could become a tool for NASA and industry
designers seeking the ultimate morphing airplane, with an airframe that can
change shape to seek desired flight parameters throughout a wide speed range.
(Source: NASA Tech Briefs)
On July 28, a NASA research jet flew to Oshkosh, WI to join the world's
largest aviation event: The Experimental Aircraft Association's
AirVenture 2003. Celebrating a century of flight, the festivities included
a NASA F/A-18 with the ability to twist its wings causing the
airplane to roll. Called wing-warping, the technique was once exploited
by the Wright brothers.
Conducted by NASA's Dryden Flight Research Center, the Active Aeroelastic
Wing program utilizes special pliable wings to initiate roll. Soon, new flight
control software will prompt the ailerons (aircraft roll control) and movable
leading edge control surfaces to respond to normal pilot stick inputs by causing
the wings to deflect. The roll induced in this manner will make the aircraft
independent of horizontal stabilizer inputs to keep it on course in a roll.
The ability to use computer flight control programs and flexible wings could
lead to future high-performance aircraft with lighter, less mechanically
complex wings. Wing-warping could become a tool for NASA and industry
designers seeking the ultimate morphing airplane, with an airframe that can
change shape to seek desired flight parameters throughout a wide speed range.
(Source: NASA Tech Briefs)
And NOT so good news (and of local interest)
IBM receives double whammy
For Big Blue, August has been decidedly unkind: first a blackout shuts down its Fishkill, NY fab, then more than 500 workers at the company's Vermont plant get pink slips.
For Big Blue, August has been decidedly unkind. First, the enormous power outage that hit the northeastern US and Canada on August 14 shut down production at the company's 300mm wafer fab in Fishkill, NY, for two days.
The timing of the blackout was particularly unfortunate, given that IBM is pumping out chips for Apple's highly anticipated G5 system, which is supposed to be launched this month. IBM also is scheduled to begin production for Nvidia's new GeForce FX graphics chip later this year, but officials wouldn't say if production of these chips was affected by the shutdown.
Then, on August 19, IBM's plant in Essex Junction, VT suffered a "blackout" of a different sort. IBM announced it would lay off 600 workers nationwide, 500 of them at its Vermont operations -- less than a month after implementing a program there to cut back on employees' hours. Another 3,000 employees will be forced to take a week's unpaid vacation in September.
The move does not affect the factory's manufacturing work force, the company said.
(Source:SST)
IBM receives double whammy
For Big Blue, August has been decidedly unkind: first a blackout shuts down its Fishkill, NY fab, then more than 500 workers at the company's Vermont plant get pink slips.
For Big Blue, August has been decidedly unkind. First, the enormous power outage that hit the northeastern US and Canada on August 14 shut down production at the company's 300mm wafer fab in Fishkill, NY, for two days.
The timing of the blackout was particularly unfortunate, given that IBM is pumping out chips for Apple's highly anticipated G5 system, which is supposed to be launched this month. IBM also is scheduled to begin production for Nvidia's new GeForce FX graphics chip later this year, but officials wouldn't say if production of these chips was affected by the shutdown.
Then, on August 19, IBM's plant in Essex Junction, VT suffered a "blackout" of a different sort. IBM announced it would lay off 600 workers nationwide, 500 of them at its Vermont operations -- less than a month after implementing a program there to cut back on employees' hours. Another 3,000 employees will be forced to take a week's unpaid vacation in September.
The move does not affect the factory's manufacturing work force, the company said.
(Source:SST)
Not too shabby...
July book-to-bill exceeds parity level (this is good!...well...it could be better)
Worldwide manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.02 in July 2003, the first time since January 2003 that the ratio has climbed above the parity level, according to VLSI Research.
Equipment manufacturers posted orders of $2.52 billion and billings of $2.47 billion in July, down from June's revised totals of $2.81 billion and $2.76 billion. Of the total billings, $1.47 billion were for wafer processing equipment, $522 million for test and related equipment, $172 million for assembly, and $308 million for service and spares.
For chipmakers, the three-month book-to-bill ratio rose to 1.12 in July, up from 1.10 in June. Worldwide bookings rose to $12.12 billion, compared with $11.93 billion in June, while billings stayed flat at $10.82 billion. Capacity utilization rate slipped from 87.9% to 85.1% in July, but remained above 90% for sub-150nm nodes.
Due to the "traditional summer slump," VLSI predicts the August book-to-bill for equipment makers will slide to an even 1.00, while the book-to-bill for chipmakers will dip to 1.07.
"Pricing weakness throughout the electronics food chain is preventing many chipmakers from investing in new capacity even though utilization rates are high, especially in the leading edge," stated VLSI. "Instead, they are more focused on raising profits and improving financial metrics."
Because of this spending lull, VLSI says its forecast for 2003 remains basically unchanged: Equipment revenues of $31.5 billion (a 6.4% increase from 2002), with IC billings of $134.2 billion (up 11.3% from 2002). For 2004, VLSI sees a robust 19% growth in equipment and 25% growth in chips, leading to "a hard upturn" extending into 2005.
(Source: SST)
July book-to-bill exceeds parity level (this is good!...well...it could be better)
Worldwide manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.02 in July 2003, the first time since January 2003 that the ratio has climbed above the parity level, according to VLSI Research.
Equipment manufacturers posted orders of $2.52 billion and billings of $2.47 billion in July, down from June's revised totals of $2.81 billion and $2.76 billion. Of the total billings, $1.47 billion were for wafer processing equipment, $522 million for test and related equipment, $172 million for assembly, and $308 million for service and spares.
For chipmakers, the three-month book-to-bill ratio rose to 1.12 in July, up from 1.10 in June. Worldwide bookings rose to $12.12 billion, compared with $11.93 billion in June, while billings stayed flat at $10.82 billion. Capacity utilization rate slipped from 87.9% to 85.1% in July, but remained above 90% for sub-150nm nodes.
Due to the "traditional summer slump," VLSI predicts the August book-to-bill for equipment makers will slide to an even 1.00, while the book-to-bill for chipmakers will dip to 1.07.
"Pricing weakness throughout the electronics food chain is preventing many chipmakers from investing in new capacity even though utilization rates are high, especially in the leading edge," stated VLSI. "Instead, they are more focused on raising profits and improving financial metrics."
Because of this spending lull, VLSI says its forecast for 2003 remains basically unchanged: Equipment revenues of $31.5 billion (a 6.4% increase from 2002), with IC billings of $134.2 billion (up 11.3% from 2002). For 2004, VLSI sees a robust 19% growth in equipment and 25% growth in chips, leading to "a hard upturn" extending into 2005.
(Source: SST)
Now, this is cool
NTT develops 81 GHz diamond device
NTT, in collaboration with the University of Ulm, Germany, has developed a diamond semiconductor device with an operating frequency of 81 GHz.
(Source: Compound Semiconductor News)
NTT develops 81 GHz diamond device
NTT, in collaboration with the University of Ulm, Germany, has developed a diamond semiconductor device with an operating frequency of 81 GHz.
(Source: Compound Semiconductor News)
Some more good news, for those into the semiconductor stuff...
SIA Q2 8-inch fab utilization up sequentially to 86.4%. The Semiconductor
Industry Association (SIA) reported wafer fab utilization rates and wafer-
start activity for Q2 last week. Q2 fab utilization for all MOS linewidths
was 85.9%, up from 82.8% in Q1'03. The 8-inch wafer utilization rate was
86.4%, up from 83.6% in Q1'03. Fab utilization at less than 0.2 micron
remains tighter than lagging edge utilizations, with utilization rates at
the advanced nodes essentially flat sequentially at 89.6%. Total Q2 8-inch
equivalent wafer starts for all linewidths were 1,308 thousand per week, up
5% sequentially (directionally consistent with historical seasonal
strength) and up 4% year-over-year.
(From Goldman Sachs U.S. Research)
SIA Q2 8-inch fab utilization up sequentially to 86.4%. The Semiconductor
Industry Association (SIA) reported wafer fab utilization rates and wafer-
start activity for Q2 last week. Q2 fab utilization for all MOS linewidths
was 85.9%, up from 82.8% in Q1'03. The 8-inch wafer utilization rate was
86.4%, up from 83.6% in Q1'03. Fab utilization at less than 0.2 micron
remains tighter than lagging edge utilizations, with utilization rates at
the advanced nodes essentially flat sequentially at 89.6%. Total Q2 8-inch
equivalent wafer starts for all linewidths were 1,308 thousand per week, up
5% sequentially (directionally consistent with historical seasonal
strength) and up 4% year-over-year.
(From Goldman Sachs U.S. Research)
And of local interest (i.e. IBM-related)...
Raytheon, IBM ink chip design deal
Raytheon, Lexington, MA, and IBM, Armonk, NY, have announced a deal to design and market systems for the aerospace and defense industries. The deal, worth up to $100 million over five years, partners IBM's custom chip and chip system design group with Raytheon, which has expertise in defense electronics and aerospace and defense.
(From SST's Semiconductor Weekly, August 11, 2003)
Raytheon, IBM ink chip design deal
Raytheon, Lexington, MA, and IBM, Armonk, NY, have announced a deal to design and market systems for the aerospace and defense industries. The deal, worth up to $100 million over five years, partners IBM's custom chip and chip system design group with Raytheon, which has expertise in defense electronics and aerospace and defense.
(From SST's Semiconductor Weekly, August 11, 2003)
Good news (about time!)
SIA: 2Q chip sales show healthy jump
Worldwide chip sales hit $37.6 billion in 2Q03, up 3.2% from the previous quarter, and up 10.4% from 2Q02. Semiconductor sales totaled $12.54 billion in June, up 0.4% from $12.49 billion in revenues in May 2003, according to data from the Semiconductor Industry Association (SIA). The May figures were revised downwards slightly from SIA's earlier estimates of $12.50 billion.
Sales in June were up significantly in nearly every segment. Sales of programmable logic and standard cell chips increased 27.5% and 15.7%, respectively, due to consumer use of broadband services. Growing demand for DVDs and DVD recording capabilities drove a 33.9% jump in optoelectronics sales, while digital camera and mobile phone demand fueled a 37.1% leap in flash memory sales.
SIA president George Scalise highlighted strong growth in the computational, consumer, and communications sectors. Year-on-year sales of computers were up nearly 8% -- the strongest growth in three years -- contributing to an 8.2% growth in microprocessor sales.
Doug Andrey, principal industry analyst at SIA, said that an approaching PC upgrade cycle is likely the cause of the boost in computer sales, the largest market for semiconductors. "A lot of PCs were bought in anticipation of Y2K," when the typical corporate desktop life was two years, he said. During recent economic times, businesses have been squeezing four to five years out of their aging desktop machines; at this point, it's often cheaper to simply replace the entire PC than perform incremental upgrades. Andrey said he expects this trend to pick up by the end of 2003.
Geographically, the Asia Pacific region grew the most on a quarter-by-quarter basis, up 5.9%, followed by Japan (5.3%) and the Americas (3.6%). A 4.1% decline in European sales was attributed to a sluggish economy and continued outsourcing of production to Asia.
Capacity utilization was at approximately 88% for 0.18-micron technologies, and up to 95% for "leading-edge" 0.15-micron technologies. "Now that inventory has been worked off, increasing demand as the year progresses will directly generate rising semiconductor sales," said Scalise.
(From SST's Semiconductor Weekly, August 11, 2003)
SIA: 2Q chip sales show healthy jump
Worldwide chip sales hit $37.6 billion in 2Q03, up 3.2% from the previous quarter, and up 10.4% from 2Q02. Semiconductor sales totaled $12.54 billion in June, up 0.4% from $12.49 billion in revenues in May 2003, according to data from the Semiconductor Industry Association (SIA). The May figures were revised downwards slightly from SIA's earlier estimates of $12.50 billion.
Sales in June were up significantly in nearly every segment. Sales of programmable logic and standard cell chips increased 27.5% and 15.7%, respectively, due to consumer use of broadband services. Growing demand for DVDs and DVD recording capabilities drove a 33.9% jump in optoelectronics sales, while digital camera and mobile phone demand fueled a 37.1% leap in flash memory sales.
SIA president George Scalise highlighted strong growth in the computational, consumer, and communications sectors. Year-on-year sales of computers were up nearly 8% -- the strongest growth in three years -- contributing to an 8.2% growth in microprocessor sales.
Doug Andrey, principal industry analyst at SIA, said that an approaching PC upgrade cycle is likely the cause of the boost in computer sales, the largest market for semiconductors. "A lot of PCs were bought in anticipation of Y2K," when the typical corporate desktop life was two years, he said. During recent economic times, businesses have been squeezing four to five years out of their aging desktop machines; at this point, it's often cheaper to simply replace the entire PC than perform incremental upgrades. Andrey said he expects this trend to pick up by the end of 2003.
Geographically, the Asia Pacific region grew the most on a quarter-by-quarter basis, up 5.9%, followed by Japan (5.3%) and the Americas (3.6%). A 4.1% decline in European sales was attributed to a sluggish economy and continued outsourcing of production to Asia.
Capacity utilization was at approximately 88% for 0.18-micron technologies, and up to 95% for "leading-edge" 0.15-micron technologies. "Now that inventory has been worked off, increasing demand as the year progresses will directly generate rising semiconductor sales," said Scalise.
(From SST's Semiconductor Weekly, August 11, 2003)
Hold on, maybe we can expect better bed manners from these guys...or not
REMOTE-PRESENCE ROBOT
While robots may never totally replace the human touch that physicians
provide, a high-tech robot being tested at The Johns Hopkins Hospital
could be used to link patients with their physicians in a whole new way.
Robots can augment regular interactions and be used when it's not
practical or possible for physicians to be there in person, such as
in military operations, natural or bioterrorist disasters, at sea, or
in other remote locations.
The robot from InTouch Health (Goleta, CA) has a computer screen for a
head, a video camera for eyes, and a speaker for a mouth. It is directly
linked to a real doctor who uses a joystick for moving it about. Looking
at a computer terminal, the doctor directing the robot sees what the robot
sees and hears what the robot hears. At the other end, patients can see
and talk to the doctor's face displayed on the flat screen. All of this
is connected to the Internet via broadband and a wireless network.
So far, Dr. Robot has checked-up on 20 patients in between regular
physician visits to find out how they are feeling, inspect their
surgical sites to ensure proper healing, and answer questions.
(From NASA Tech Briefs)
REMOTE-PRESENCE ROBOT
While robots may never totally replace the human touch that physicians
provide, a high-tech robot being tested at The Johns Hopkins Hospital
could be used to link patients with their physicians in a whole new way.
Robots can augment regular interactions and be used when it's not
practical or possible for physicians to be there in person, such as
in military operations, natural or bioterrorist disasters, at sea, or
in other remote locations.
The robot from InTouch Health (Goleta, CA) has a computer screen for a
head, a video camera for eyes, and a speaker for a mouth. It is directly
linked to a real doctor who uses a joystick for moving it about. Looking
at a computer terminal, the doctor directing the robot sees what the robot
sees and hears what the robot hears. At the other end, patients can see
and talk to the doctor's face displayed on the flat screen. All of this
is connected to the Internet via broadband and a wireless network.
So far, Dr. Robot has checked-up on 20 patients in between regular
physician visits to find out how they are feeling, inspect their
surgical sites to ensure proper healing, and answer questions.
(From NASA Tech Briefs)
Ouch! Yapping on the cell phone NOT a cool thing anymore...
Wireless subscribers to reach two billion by 2007
The total number of worldwide subscribers to wireless cellular services will exceed 2 billion by 2007, according to a new report from In-Stat/MDR.
(CS News Week 33)
Wireless subscribers to reach two billion by 2007
The total number of worldwide subscribers to wireless cellular services will exceed 2 billion by 2007, according to a new report from In-Stat/MDR.
(CS News Week 33)
And some tech (geeky) news...
Keeping Moore's Law alive
NASA scientists have developed a technique to use carbon nanotubes in place of copper conductors as interconnects on ICs, according to a report by the Gale Group. The carbon nanotubes can carry immense current densities (greater than 1 million amps/sq. cm) with little or no deterioration; copper, comparatively, has resistive properties that are inversely proportional to its size.
The incredible shrinking chip
Researchers at Texas Instruments and the University of North Texas in Denton, TX, are working on techniques to enable the building of semiconductor chips half the size of current chips. The bulk of the work, supported by a $2.2 million grant from the National Science Foundation, will focus on solving the problem of "cross talk," electron interference that is blocking efforts to shrink chip size.
(From SST Semiconducor Weekly)
Keeping Moore's Law alive
NASA scientists have developed a technique to use carbon nanotubes in place of copper conductors as interconnects on ICs, according to a report by the Gale Group. The carbon nanotubes can carry immense current densities (greater than 1 million amps/sq. cm) with little or no deterioration; copper, comparatively, has resistive properties that are inversely proportional to its size.
The incredible shrinking chip
Researchers at Texas Instruments and the University of North Texas in Denton, TX, are working on techniques to enable the building of semiconductor chips half the size of current chips. The bulk of the work, supported by a $2.2 million grant from the National Science Foundation, will focus on solving the problem of "cross talk," electron interference that is blocking efforts to shrink chip size.
(From SST Semiconducor Weekly)
I am sure you were wondering...what carbon nanotubes are...
Carbon nanotubes are hollow cylinders -- either metallic or semiconducting
-- with diameters 10,000 times smaller than that of a human hair. They're
made of carbon atoms, and exhibit tensile strength more than 100 times
that of steel. Since they possess unequalled mechanical, chemical, and
thermal properties, the applications for these structures are unlimited.
Carbon nanotubes are hollow cylinders -- either metallic or semiconducting
-- with diameters 10,000 times smaller than that of a human hair. They're
made of carbon atoms, and exhibit tensile strength more than 100 times
that of steel. Since they possess unequalled mechanical, chemical, and
thermal properties, the applications for these structures are unlimited.
Hey, so...you an inventor? Here could be an useful outcome from all those taken appart toasters
Emhart Teknologies and NASA Tech Briefs are proud to announce the official
start of the Second Annual "Create the Future" Design Contest.
Last year more than 1,000 qualified entries poured in for this nationwide
design contest. Once again, the contest -- co-sponsored by Allfast Fastening
Systems and SolidWorks -- will recognize outstanding innovation and applications
in the field of product design. Engineering professionals, students, and the
general public are invited to submit innovative designs for products in three
categories:
1. Everyday Products -- A functional or ergonomic new product, or an
upgrade to an existing product, that improves quality of life
2. Safety -- A mechanical or electromechanical device that improves
personal safety during travel, work, recreation, or at home
3. Transportation -- A mechanical or electromechanical product that
improves the functionality, performance, or cost basis of a
transportation product.
Entries will be judged on innovation, manufacturability, marketability, and
cost-effectiveness. Winners not only receive great prizes, but also get the
recognition and support needed to take their ideas from the drawing board to
the production line.
Prizes include:
* One Grand-Prize Winner, a hybrid automobile or $20,000 in cash
* One First-Prize Winner, a Segway Transporter or a trip for two to
the U.S. Space Camp, valued at $5,000
* Three Second-Prize Winners, a DeWalt Power Tool Combination Kit,
valued at $500.
* All qualified entrants, an Emhart POP(r) PowerLink 30 repair
kit/hand rivet tool, valued at $50
Visit the contest Web site at http://link.abpi.net/l.php?20030903A5 for
the official entry form and rules.
(From NASA Tech Briefs)
Emhart Teknologies and NASA Tech Briefs are proud to announce the official
start of the Second Annual "Create the Future" Design Contest.
Last year more than 1,000 qualified entries poured in for this nationwide
design contest. Once again, the contest -- co-sponsored by Allfast Fastening
Systems and SolidWorks -- will recognize outstanding innovation and applications
in the field of product design. Engineering professionals, students, and the
general public are invited to submit innovative designs for products in three
categories:
1. Everyday Products -- A functional or ergonomic new product, or an
upgrade to an existing product, that improves quality of life
2. Safety -- A mechanical or electromechanical device that improves
personal safety during travel, work, recreation, or at home
3. Transportation -- A mechanical or electromechanical product that
improves the functionality, performance, or cost basis of a
transportation product.
Entries will be judged on innovation, manufacturability, marketability, and
cost-effectiveness. Winners not only receive great prizes, but also get the
recognition and support needed to take their ideas from the drawing board to
the production line.
Prizes include:
* One Grand-Prize Winner, a hybrid automobile or $20,000 in cash
* One First-Prize Winner, a Segway Transporter or a trip for two to
the U.S. Space Camp, valued at $5,000
* Three Second-Prize Winners, a DeWalt Power Tool Combination Kit,
valued at $500.
* All qualified entrants, an Emhart POP(r) PowerLink 30 repair
kit/hand rivet tool, valued at $50
Visit the contest Web site at http://link.abpi.net/l.php?20030903A5 for
the official entry form and rules.
(From NASA Tech Briefs)
